Wafer-Level PackagingAs products become smaller, thinner, and more power packed, so too do their internals.
The packaging industry has quickly adopted cutting-edge “Wafer Level Packaging” technologies that dramatically reduce size and cost of packaged integrated circuits.
Solderless Printed Circuit Board (PCB) Assembly Occam technology has achieved critical acclaim by industry leaders in electronics assembly due to its practical approach to increased reliability and low cost of electronic assembly by eliminating solder.
Nexus Torsion ConnectorNexus connectors are cheaper to manufacture, provide stronger and more robust connections without degrading resiliency issues, and introduce the possibility of Zero Force Insertion.